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Our Technology

enables on-board Real-time SAR image processing with the following key features:

Heterogeneous Architecture

Better Performance & Power Efficiency

Our chip requires power less than 2 W, nearly 50 - 100 times more energy-efficient than existing FPGA or GPU solutions, for on-board computing

  • Low Power (2 W)
  • Minimizes energy use to extend battery life and reduce heat, enabling efficient AI performance.

  • Faster Computing
  • Packs more processing power into a smaller chip area, allowing 2 times faster AI computations and handling complex tasks efficiently. Achieving 2× better performance-per-watt than leading AI chips.

This high compute efficiency enables faster AI processing with significantly lower energy costs, allowing real-time data processing in-orbit and reducing downlink bandwidth requirements by a factor of 10 to 100 —critical for defense, data centers, edge devices, and scalable AI deployment.

AI-Integrated Engine

AI-Integrated Engine

Our architecture is designed to handle a wide range of AI model types efficiently, enabling flexible and powerful performance across diverse applications.

Radiation-hardened ASIC chip

Radiation-Tolerant & -Hardened ASIC design

Custom-designed ASIC solutions tailored for LEO satellite missions, ranging from radiation-tolerant chips to fully radiation-hardened designs. Our architectures are engineered to operate reliably under space radiation and temperature variations, delivering high computational reliability, low power consumption, and real-time on-board data processing for long-duration SAR satellite operations.